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  • Emerging technologies for sustainable smart city network security: Issues, challenges, and countermeasures

    Jo, J. H., Sharma, P. K., Sicato, J. C. S., Park, J. H.

    Journal of Information Processing Systems, vol. 15, no. 4, pp. 765-784

    Contributions to Journals: Articles

  • Location Tracking Using Smartphone Accelerometer and Magnetometer Traces

    Nguyen, D. K. A., Akram, R. N., Markantonakis, K., Luo, Z., Watkins, C.

    Chapters in Books, Reports and Conference Proceedings: Conference Proceedings

  • A blockchain-based decentralized efficient investigation framework for IoT digital forensics

    Ryu, J. H., Sharma, P. K., Jo, J. H., Park, J. H.

    Journal of Supercomputing, vol. 75, no. 8, pp. 4372-4387

    Contributions to Journals: Articles

  • A comprehensive study on APT attacks and countermeasures for future networks and communications: challenges and solutions

    Singh, S., Sharma, P. K., Moon, S. Y., Moon, D., Park, J. H.

    Journal of Supercomputing, vol. 75, no. 8, pp. 4543-4574

    Contributions to Journals: Articles

  • Blockchain-Based Distributed Framework for Automotive Industry in a Smart City

    Sharma, P. K., Kumar, N., Park, J. H.

    IEEE Transactions on Industrial Informatics, vol. 15, no. 7, pp. 4197-4205

    Contributions to Journals: Articles

  • SHSec: SDN based Secure Smart Home Network Architecture for Internet of Things

    Sharma, P. K., Park, J. H., Jeong, Y. S., Park, J. H.

    Mobile Networks and Applications, vol. 24, no. 3, pp. 913-924

    Contributions to Journals: Articles

  • An Evaluation of the Security of the Bitcoin Peer-To-Peer Network

    Tapsell, J., Akram, R. N., Markantonakis, K.

    Chapters in Books, Reports and Conference Proceedings: Conference Proceedings

  • Ensuring Secure Application Execution and Platform Specific Execution in Embedded Devices

    Lee, R., Markantonakis, K., Akram, R. N.

    ACM Transactions on Embedded Computing Systems, vol. 18, no. 3, 26

    Contributions to Journals: Articles

  • Removing epoxy underfill between neighbouring components using acid for component chip-off

    Heckmann, T., McEvoy, J., Markantonakis, K., Akram, R. N., Naccache, D.

    Digital Investigation, vol. 29, pp. 198-209

    Contributions to Journals: Articles

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